TECHNICAL

MODULE ASSEMBLY

Various advanced assembly techniques are used for connecting the CMOS driver IC’s to the LCD panel:

SMTSurface Mount (SMT): The flat pack driver IC’s are reflow soldered to the rear surface of a PCB. The LCD panel is connected to the PCB using elastomeric or heat seal connectors.
COBChip On Board (COB): The driver IC dice are wire-bonded directly to the rear surface of a PCB. The LCD panel is connected to the PCB using elastomeric or heat seal connectors.
TABTape Automated Bonding (TAB): One end of the Tape Carrier Package (TCP) containing the driver IC is bonded to the LCD panel. The other end is either bonded to a PCB.
COGChip On Glass (COG): The driver IC gold bumps are bonded directly to the edge of LCD panel and an FPC tail is bonded to a PCB or inserted into a ZIF connector.
COFChip On Flex (COF): The driver IC die is bonded to a flex circuit. One end of the flex circuit is bonded to the LCD panel, and the other end is bonded to a PCB or inserted into a ZIF connector.
Site design by PSH Group, LLC.